Honghuang, I am engaged in science and technology in the Wuzu

After turning around, Fang Hao found that the entire laboratory was almost entirely manual work.

“When will such hand-made electronic components develop into the Internet era!” Walking out of the laboratory, Fang Hao couldn’t help sighing.

The technological system of modern society includes four major fields, and the fields are all-encompassing.

The first is the power system, including hydropower, nuclear power, wind power, thermal power, and solar energy.

The second is engines, including steam engines, fuel engines, electric engines, aero engines, and ion engines.

The third is communication, including chips, networks, satellites and so on.

The fourth is materials, including organic materials, inorganic materials, metal materials, composite materials and so on.

The functions of these systems are developed on the basis of chips, and the current level of chip development in Redstone City is still in the most primitive stage.

Not only that, the instruction set of the computer system has not yet been perfected, and the most important thing is that there is no external pressure in Redstone City, and the development of technology is very slow.

On the earth, because of the pressure of living space, many people have not yet solved the problem of food and clothing, so they strive to develop science and technology to make money, and science and technology are changing with each passing day.

But in the flood famine, it is different, many people can absorb Spiritual Qi because of cultivation, and Spiritual Qi can provide energy to the body, and they can eat several times a year.

After food and clothing, people have no motivation to do such hard work as scientific research, and most people have biological inertia and can lie down and never stand.

Therefore, the hundreds of thousands of people in Redstone City only have tens of thousands of people conducting scientific research, and the rest of the day is used as immortals to meditate and practice qi, and the life is not easy, the qualifications of the flood and desolate creatures are too good, and a little cultivation can reach a very high realm.

Those with poor cultivation qualifications are what I need the most, perhaps this is the reason why the saint wants to destroy the Flood Barren cultivation system, Fang Hao has a glimmer of understanding in his heart.

Especially in the era of the universe starry sky, the spiritual energy of various life planets is thin, and it is impossible to cultivate true refining tools, so people have to develop science and technology.

Fang Hao shook his head, erased the bad thoughts in his mind, combined with the industrial state he saw, and began to write a semiconductor development plan.

Semiconductors are slowly developed from manual manufacturing to machine automation, and in the history of the earth, the principle of semiconductors alone took 113 years, from 1833 to 1947, not overnight.

And to develop chips, a major breakthrough in machinery is required, and the processing accuracy of machinery must reach the atomic level, including 16 kinds of mechanical equipment.

Because of his extremely high cultivation, Fang Hao could recall almost all the memories of his previous life.

While recalling the information, Fang Hao used his knowledge to analyze, list the technologies that these devices need to overcome, and think about how to achieve it.

1, lithography machine, on the surface of the silicon wafer coated with photoresist, and then with a negative-like thing covered on the photoresist coated silicon wafer, and then light, let the photoresist shape, the device or circuit structure temporarily copied to the silicon wafer, but Redstone semiconductor laboratory is now manufactured by hand.

The lithography machine is automatically manufactured, the accuracy of the operation is nanometer-level, the technology covered is very high, the required processing accuracy needs to be nanometer level, that is, atomic level, 30 atoms arranged in a line is one nanometer.

2. Plasma etching machine, that is, the vacuum diffusion process in the manual process, put the photo-etched silicon wafer and diffusion material into the vacuum container, let the diffusion material form plasma under the action of external energy, let part of the plasma chemically react with the photoresist, generate volatile products, let the other part of the plasma accelerate under the action of the electric field, bombard part of the photoresist on the silicon wafer, and realize the directional corrosion of the surface of the silicon wafer.

Photoresist is divided into two types, one part is not easy to etch, part is easy to etch, put into the etching machine to produce the effect of etching, the part that is easy to etch disappears, the part that is not easy to etch still exists, the result will lead to the etching photoresist to make part of the silicon wafer disappear, so that the silicon wafer constitutes a complex circuit template, equivalent to the paper cut used in the New Year.

3. Reactive ion etching machine, applying high-frequency voltage between the plate electrodes, produces an ion layer hundreds of microns thick, and the concentration and uniformity of these ions have high requirements.

4. Ion implanter, doping the area near the semiconductor surface, controlling the ions between the electrodes to hit the silicon wafer at high speed, so that the ion bombardment enters the silicon wafer to realize the doping processing of the semiconductor.

If the ions between the electrodes are pentavalent phosphorus ions, they can form p-type semiconductors, and if the ions between the electrodes are trivalent boron ions, they can form n-type semiconductors.

In addition, the reactive ion etching machine can also control the doping concentration to obtain semiconductors with various doped concentrations.

5. Single crystal furnace, melting semiconductor materials, pulling single crystals, providing single crystal semiconductor blanks for subsequent semiconductor device manufacturing.

The so-called single crystal, that is, silicon wafer, the typical feature is that all atoms are in the same plane, and layer by layer, the technical requirements are very high, the larger the wafer manufacturing difficulty.

6. Wafer dicing machine, the wafer is cut into small pieces, and the atoms of the wafer are required to be in the same plane

7. Wafer thinning machine, through polishing, the thickness of the wafer is thinned, which is the category of mechanical processing, that is, the use of CNC machines to use blades to cut slowly, precision atomic level.

8. Gas phase epitaxial furnace, let the single crystal substrate slowly grow atoms layer by layer, forming a basic structure for the growth of single crystal.

9. The molecular beam epitaxy system attracts molten silicon ions on the substrate surface, and under suitable conditions, silicon ions will grow layer by layer in the direction of the crystal shaft, and form single crystals after cooling.

10. Oxidation furnace, the semiconductor material oxidation treatment, so that the semiconductor is oxidized to silica, which is an insulating material.

11. Low-pressure chemical vapor deposition system, the vapor of the chemical reactant is introduced into the reaction chamber, and a chemical reaction occurs on the surface of the substrate to generate a film.

12. Plasma-enhanced chemical vapor deposition system, using glow discharge, let the plasma ionize and carry out a chemical reaction on the silicon wafer substrate to deposit semiconductor thin film materials.

13. The magnetron sputtering table forms an orthogonal electromagnetic field inside the equipment, binds the electrons to a specific area on the surface of the processing target, realizes high ion density and high energy ionization, and allows specific atoms to form a thin film on the substrate.

14. Chemical mechanical polishing machine, through the comprehensive action of mechanical grinding and chemical dissolution, semiconductors are ground and polished.

15, wire bonding machine, the semiconductor chip on the output point and the outer package pin with conductive metal wire, if it is a high-end chip, generally use gold as a connection material, which is also an important reason why gold can be used as a precious metal.

16. Probe test bench, through the pin contact between the probe and the semiconductor device, electrical test is carried out to detect whether the performance indicators of the semiconductor meet the design performance requirements.